Electronic device including air adsorption member and speaker module

ABSTRACT

In various embodiments, an electronic device includes: a diaphragm, a speaker module including a speaker configured to output a sound through a vibration of the diaphragm, and a housing accommodating the diaphragm and the speaker module therein and including a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite the first direction. The electronic device further includes an air adsorption member comprising an air adsorbing material disposed in the first space and having a volume ratio of 90% or less of the first space, the air adsorption member configured to reduce air resistance to the diaphragm disposed above the speaker module without limiting the vibration of the diaphragm.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based on and claims priority under 35 U.S.C. § 119to Korean Patent Application No. 10-2019-0094579, filed on Aug. 2, 2019,in the Korean Intellectual Property Office, the disclosure of which isincorporated by reference herein in its entirety.

BACKGROUND Field

The disclosure relates to an electronic device including an airadsorption member capable of minimizing and/or reducing air resistanceto vibration of a diaphragm disposed above a speaker module.

Description of Related Art

With a great variety of portable electronic devices such as smart phonespopularized, various modules that perform particular functions are beingprovided in the electronic devices. For example, the electronic devicemay include at least one speaker module for outputting sounds. Thespeaker module may convert an electrical signal generated at theelectronic device into an audible sound signal through the vibration ofa diaphragm and output the sound signal.

As the thickness of the electronic device becomes thinner, the speakermodule as well needs to be thinner. When the speaker module becomesthin, a vibration space of the diaphragm may be narrowed.

In the electronic device, sounds having opposite phases may be producedin a first direction (e.g., a rear surface) and a second direction(e.g., a front surface) of the diaphragm. Therefore, in order to preventand/or reduce destructive interference due to the opposite phases of thefirst and second directions, the electronic device may be designed toseparate a first space formed in the first direction and a second spaceformed in the second direction with respect to the diaphragm.

The diaphragm of the speaker module equipped in the electronic devicemay be limited in vibration due to the resistance of ambient air, sothat the sound reproduction efficiency may be lowered. For example, whenthe vibration of the diaphragm is limited, the sound output through thespeaker module may be reduced or the sound quality may be degraded.

SUMMARY

Embodiments of the disclosure may provide an electronic device includingan air adsorption member disposed in a certain space (e.g., a rearspace) of a housing in which a speaker module is mounted. The airadsorption member facilitates compression and relaxation of air, therebyminimizing and/or reducing air resistance to a diaphragm disposed abovethe speaker module without limiting the vibration of the diaphragm. Inaddition, this may secure a reliable amplitude of the diaphragm andthereby improve a sound quality of a low frequency band.

According to various example embodiments of the disclosure, anelectronic device may include: a diaphragm; a speaker module comprisingat least one speaker configured to output a sound through a vibration ofthe diaphragm; a housing accommodating the diaphragm and the speakermodule therein and including a first space provided in a first directionfrom the speaker module, and a second space provided in a seconddirection opposite the first direction; and an air adsorption membercomprising an air adsorption material disposed in the first space andhaving a volume ratio of 90% or less of the first space.

According to various example embodiments of the disclosure, anelectronic device may include: a diaphragm; a speaker module comprisingat least one speaker configured to output a sound through a vibration ofthe diaphragm; a housing accommodating the diaphragm and the speakermodule therein, the housing including a first housing disposed at anupper position of the electronic device and a second housing disposed ata lower position of the electronic device, the housing including a firstspace provided in a first direction from the speaker module, and asecond space provided in a second direction opposite the firstdirection; and an air adsorption member comprising an air adsorptionmaterial disposed in at least a part of the first and/or the secondhousing or disposed between the first and the second housing, andconfigured to adsorb air in the first space and/or the second space.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and advantages of certainembodiments of the present disclosure will be more apparent from thefollowing detailed description, taken in conjunction with theaccompanying drawings, in which:

FIG. 1 is a perspective view illustrating a front surface of an examplemobile electronic device according to an embodiment of the disclosure;

FIG. 2 is a perspective view illustrating a rear surface of the mobileelectronic device shown in FIG. 1 according to an embodiment of thedisclosure;

FIG. 3 is an exploded perspective view illustrating the mobileelectronic device shown in FIGS. 1 and 2 according to an embodiment ofthe disclosure;

FIG. 4 is a cross-sectional view illustrating an example configurationof an example electronic device including an air adsorption member and aspeaker module according to an embodiment of the disclosure;

FIG. 5 is a diagram illustrating an example air adsorption memberincluded in an electronic device according to an embodiment of thedisclosure;

FIG. 6 is a diagram illustrating an example air adsorption memberincluded in an electronic device according to an embodiment of thedisclosure;

FIG. 7 is a diagram illustrating a molecular structure of an example airadsorption material included in an electronic device according tovarious embodiments of the disclosure;

FIG. 8 is a diagram illustrating an example air adsorption member fixedto a housing of an electronic device according to an embodiment of thedisclosure;

FIG. 9 is a diagram illustrating an example air adsorption member fixedto a housing of an electronic device according to an embodiment of thedisclosure;

FIG. 10 is a diagram illustrating an example air adsorption member fixedto a housing of an electronic device according to an embodiment of thedisclosure;

FIG. 11 is a diagram illustrating an example air adsorption member fixedby a rib formed in a housing of an electronic device according to anembodiment of the disclosure;

FIG. 12 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure;

FIG. 13 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure;

FIG. 14 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure;

FIG. 15 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure;

FIG. 16 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure;

FIG. 17 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure;

FIG. 18 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure;

DETAILED DESCRIPTION

Various example embodiments of the disclosure will be described ingreater detail below with reference to the accompanying drawings.

The following description with reference to the accompanying drawings isprovided to aid in understanding of various embodiments of thedisclosure. It includes various details to assist in that understandingbut these are to be regarded as merely examples. Accordingly, those ofordinary skill in the art will recognize that various changes andmodifications of the various example embodiments described herein can bemade without departing from the scope and spirit of the disclosure. Inaddition, descriptions of well-known functions and constructions may beomitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used to enableunderstanding of the disclosure. Accordingly, it should be apparent tothose skilled in the art that the following description of variousexample embodiments of the disclosure is provided for illustrationpurpose only and not for the purpose of limiting the disclosure.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

FIG. 1 is a perspective view illustrating a front surface of an examplemobile electronic device according to an embodiment of the disclosure.

FIG. 2 is a perspective view illustrating a rear surface of theelectronic device of FIG. 1 according to an embodiment of thedisclosure.

Referring to FIG. 1 and FIG. 2 , an electronic device 100 according toan embodiment may include a housing 110 including a first surface (orfront surface) 110A, a second surface (or rear surface) 110B, and a sidesurface 110C surrounding the space between the first surface 110A andthe second surface 110B. In another embodiment (not illustrated), thehousing may denote a structure that forms a part of the first surface110A, the second surface 110B, and the side surface 110C illustrated inFIG. 1 . According to an embodiment, the first surface 110A may beformed by a front plate 102, at least a part of which is substantiallytransparent (for example, a glass plate including various coatinglayers, or a polymer plate). The second surface 110B may be formed by arear plate 111 that is substantially opaque. The rear plate 111 may bemade of coated or colored glass, ceramic, polymer, metal (for example,aluminum, stainless steel (STS), or magnesium), or a combination of atleast two of the above-mentioned materials. The side surface 110C may beformed by a side bezel structure (or “side member”) 118 which is coupledto the front plate 102 and to the rear plate 111, and which includesmetal and/or polymer. In some embodiments, the rear plate 111 and theside bezel structure 118 may be formed integrally and may include thesame material (for example, a metal material such as aluminum).

In the illustrated embodiment, the front plate 102 may include two firstareas 110D on both ends of the long edge of the front plate 102 suchthat the two first areas 110D bend from the first surface 110A towardthe rear plate 111 and extend seamlessly. In the illustrated embodiment(see FIG. 2 ), the rear plate 111 may include two second areas 110E onboth ends of the long edge such that the two second areas 110E bend fromthe second surface 110B toward the front plate 102 and extendseamlessly. In some embodiments, the front plate 102 (or the rear plate111) may include only one of the first areas 110D (or the second areas110E). In another embodiment, a part of the first areas 110D or thesecond areas 110E may not be included. In the above embodiments, whenseen from the side surface of the electronic device 100, the side bezelstructure 118 may have a first thickness (or width) on a part of theside surface, which does not include the first areas 110D or the secondareas 110E as described above, and may have a second thickness that issmaller than the first thickness on a part of the side surface, whichincludes the first areas 110D or the second areas 110E.

According to an embodiment, the electronic device 100 may include atleast one of a display 101, audio modules 103, 107, and 114, sensormodules 104, 116, and 119, camera modules 105, 112, and 113, a key inputdevice 117, a light-emitting element 106, and connector holes 108 and109. In some embodiments, at least one of the elements (for example, thekey input device 117 or the light-emitting element 106) of theelectronic device 100 may be omitted, or the electronic device 100 mayadditionally include another element.

The display 101 may be exposed through a corresponding part of the frontplate 102, for example. In some embodiments, at least a part of thedisplay 101 may be exposed through the front plate 102 that forms thefirst areas 110D of the side surface 110C and the first surface 110A. Insome embodiments, the display 101 may have a corner formed insubstantially the same shape as that of the adjacent outer periphery ofthe front plate 102. In another embodiment (not illustrated), in orderto increase the area of exposure of the display 101, the intervalbetween the outer periphery of the display 101 and the outer peripheryof the front plate 102 may be formed to be substantially identical.

In another embodiment (not illustrated), a recess or an opening may beformed in a part of the screen display area of the display 101, and atleast one of an audio module 114, a sensor module 104, a camera module105, and a light-emitting element 106 may be included and aligned withthe recess or the opening. In another embodiment (not illustrated), onthe back surface of the screen display area of the display 101, at leastone of an audio module 114, a sensor module 104, a camera module 105, afingerprint sensor 116, and a light-emitting element 106 may beincluded. In another embodiment (not illustrated), the display 101 maybe coupled to or arranged adjacent to a touch sensing circuit, apressure sensor capable of measuring the intensity (pressure) of atouch, and/or a digitizer that detects a magnetic field-type stylus pen.In some embodiments, at least a part of the sensor modules 104 and 119and/or at least a part of the key input device 117 may be arranged inthe first areas 110D and/or the second areas 110E.

The audio modules 103, 107, and 114 may include a microphone hole 103and speaker holes 107 and 114. A microphone for acquiring an externalsound may be arranged in the microphone hole 103, and a plurality ofmicrophones may be arranged therein such that the direction of a soundcan be sensed in some embodiments. The speaker holes 107 and 114 mayinclude an outer speaker hole 107 and a speech receiver hole 114. Insome embodiments, the speaker holes 107 and 114 and the microphone hole103 may be implemented as a single hole, or a speaker may be included(for example, a piezoelectric speaker) without the speaker holes 107 and114.

The sensor modules 104, 116, and 119 may generate an electric signal ora data value corresponding to the internal operating condition of theelectronic device 100 or the external environment condition thereof. Thesensor modules 104, 116, and 119 may include, for example, a firstsensor module 104 (for example, a proximity sensor) arranged on thefirst surface 110A of the housing 110, and/or a second sensor module(not illustrated) (for example, a fingerprint sensor), and/or a thirdsensor module 119 (for example, an HRM sensor) arranged on the secondsurface 110B of the housing 110, and/or a fourth sensor module 116 (forexample, a fingerprint sensor). The fingerprint sensor may be arrangednot only on the first surface 110A (for example, the display 101) of thehousing 110, but also on the second surface 110B thereof. The electronicdevice 100 may further include a sensor module not illustrated, forexample, at least one of a gesture sensor, a gyro sensor, an atmosphericpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a color sensor, an infrared (IR) sensor, a biometric sensor, atemperature sensor, a humidity sensor, or a luminance sensor 104.

The camera modules 105, 112, and 113 may include a first camera device105 arranged on the first surface 110A of the electronic device 100, asecond camera device 112 arranged on the second surface 110B thereof,and/or a flash 113. The camera devices 105 and 112 may include a singlelens or a plurality of lenses, an image sensor, and/or an image signalprocessor. The flash 113 may include, for example, a light-emittingdiode or a xenon lamp. In some embodiments, two or more lenses (aninfrared camera, a wide-angle lens, and a telephoto lens) and imagesensors may be arranged on a single surface of the electronic device100.

The key input device 117 may be arranged on the side surface 110C of thehousing 110. In another embodiment, the electronic device 100 may notinclude a part of the above-mentioned key input device 117 or the entirekey input device 117, and the key input device 117 (not included) may beimplemented in another type, such as a soft key, on the display 101. Insome embodiments, the key input device may include a sensor module 116arranged on the second surface 110B of the housing 110.

The light-emitting element 106 may be arranged on the first surface 110Aof the housing 110, for example. The light-emitting element 106 mayprovide information regarding the condition of the electronic device 100in a light type, for example. In another embodiment, the light-emittingelement 106 may provide a light source that interworks with operation ofthe camera module 105, for example. The light-emitting element 106 mayinclude, for example, a light-emitting diode (LED), an infraredlight-emitting diode (IR LED), and a xenon lamp.

The connector holes 108 and 109 may include a first connector hole 108capable of containing a connector (for example, a universal serial bus(USB) connector) for transmitting/receiving power and/or data to/from anexternal electronic device, and/or a second connector hole (for example,an earphone jack) 109 capable of containing a connector fortransmitting/receiving an audio signal to/from the external electronicdevice.

FIG. 3 is an exploded perspective view illustrating the electronicdevice of FIG. 1 according to an embodiment of the disclosure.

Referring to FIG. 3 , an electronic device 300 may include a side bezelstructure 310, a first support member 311 (for example, a bracket), afront plate 320, a display 330, a printed circuit board 340, a battery350, a second support member 360 (for example, a rear case), an antenna370, and a rear plate 380. In some embodiments, at least one of theelements (for example, the first support member 311 or the secondsupport member 360) of the electronic device 300 may be omitted, or theelectronic device 300 may further include another element. At least oneof the elements of the electronic device 300 may be identical or similarto at least one of the elements of the electronic device 100 of FIG. 1or FIG. 2 , and repeated descriptions thereof will be omitted herein.

The first support member 311 may be arranged inside the electronicdevice 300 and connected to the side bezel structure 310, or may beformed integrally with the side bezel structure 310. The first supportmember 311 may be made of a metal material and/or a nonmetal (forexample, polymer) material, for example. The display 330 may be coupledto one surface of the first support member 311, and the printed circuitboard 340 may be coupled to the other surface thereof. A processor, amemory, and/or an interface may be mounted on the printed circuit board340. The processor may include, for example, one or more of a centralprocessing device, an application processor, a graphic processingdevice, an image signal processor, a sensor hub processor, or acommunication processor.

The memory may include a volatile memory or a non-volatile memory, forexample.

The interface may include, for example, a high definition multimediainterface (HDMI), a universal serial bus (USB) interface, a securedigital (SD) card interface, and/or an audio interface. The interfacemay connect the electronic device 300 with an external electronic deviceelectrically or physically, for example, and may include a USBconnector, an SD card/multi-media card (MMC) connector, or an audioconnector.

The battery 350 is a device for supplying power to at least one elementof the electronic device 300, and may include a non-rechargeable primarycell, a rechargeable secondary cell, or a fuel cell, for example. Atleast a part of the battery 350 may be arranged on substantially thesame plane with the printed circuit board 340, for example. The battery350 may be arranged integrally inside the electronic device 300, or maybe arranged such that the same can be attached to/detached from theelectronic device 300.

The antenna 370 may be arranged between the rear plate 380 and thebattery 350. The antenna 370 may include, for example, a near fieldcommunication (NFC) antenna, a wireless charging antenna, and/or amagnetic secure transmission (MST) antenna. The antenna 370 may conductnear-field communication with an external device or may wirelesslytransmit/receive power necessary for charging, for example. In anotherembodiment, an antenna structure may be formed by a part or acombination of the side bezel structure 310 and/or the first supportmember 311.

The electronic devices may include at least one of various medicaldevices (e.g., various portable medical measurement devices (such asblood glucose meters, heart rate monitors, blood pressure monitors, orthermometers, and the like), a magnetic resonance angiography (MRA)device, a magnetic resonance imaging (MRI) device, a computed tomography(CT) device, scanners, or ultrasonic devices, and the like), navigationdevices, global positioning system (GPS) receivers, event data recorders(EDRs), flight data recorders (FDRs), vehicle infotainment devices,electronic equipment for vessels (e.g., navigation systems,gyrocompasses, and the like), avionics, security devices, head units forvehicles, industrial or home robots, automatic teller machines (ATMs),points of sales (POSs) devices, or Internet of Things (IoT) devices(e.g., light bulbs, various sensors, electric or gas meters, sprinklerdevices, fire alarms, thermostats, street lamps, toasters, exerciseequipment, hot water tanks, heaters, boilers, and the like).

The electronic devices may further include at least one of parts offurniture or buildings/structures, electronic boards, electronicsignature receiving devices, projectors, or various measuringinstruments (such as water meters, electricity meters, gas meters, orwave meters, and the like). The electronic devices may be one or morecombinations of the above-mentioned devices. The electronic devices maybe flexible electronic devices. Also, the electronic devices are notlimited to the above-mentioned devices, and may include new electronicdevices according to the development of new technologies.

Embodiments of the disclosure will be described in greater detail belowwith reference to the accompanying drawings. However, the embodiments ofthe disclosure are not limited to the specific embodiments and should beunderstood as including all modifications, changes, equivalent devicesand methods, and/or alternative embodiments of the disclosure.

The terms “A or B,” “at least one of A or/and B,” or “one or more of Aor/and B” as used herein include all possible combinations of itemsenumerated with them. For example, “A or B,” “at least one of A and B,”or “at least one of A or B” may refer, for example, to (1) including atleast one A, (2) including at least one B, or (3) including both atleast one A and at least one B.

The terms such as “first” and “second” as used herein may modify variouselements regardless of an order and/or importance of the correspondingelements, and do not limit the corresponding elements. These terms maybe used for the purpose of distinguishing one element from anotherelement. For example, a first user device and a second user device mayindicate different user devices regardless of the order or importance.For example, a first element may be referred to as a second elementwithout departing from the scope the disclosure, and similarly, a secondelement may be referred to as a first element.

It will be understood that, when an element (for example, a firstelement) is “(operatively or communicatively) coupled with/to” or“connected to” another element (for example, a second element), theelement may be directly coupled with/to another element, and there maybe an intervening element (for example, a third element) between theelement and another element. It will also be understood that, when anelement (for example, a first element) is “directly coupled with/to” or“directly connected to” another element (for example, a second element),there is no intervening element (for example, a third element) betweenthe element and another element.

The term “module” as used herein may be defined as, for example, a unitincluding one of hardware, software, and firmware or any combinationsthereof. The term “module” may be interchangeably used with, forexample, the terms “unit”, “logic”, “logical block”, “component”, or“circuit”, and the like. The “module” may be a minimum unit of anintegrated component or a part thereof. The “module” may be a minimumunit performing one or more functions or a part thereof.

FIG. 4 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure.

Referring to FIG. 4 , the electronic device 400 (e.g., the electronicdevice 100 in FIG. 1 or the electronic device 300 in FIG. 3 ) accordingto an embodiment may include a diaphragm 410, a speaker module (e.g.,including a speaker) 420, a housing 450 (e.g., the housing 110 in FIG. 1), a first space 460, a second space 470, and an air adsorption member500.

According to an embodiment, the diaphragm 410 may produce sound throughan upward and downward vibration. The sound produced through thevibration of the diaphragm 410 may be output through a sound output port402 formed or provided in a certain direction.

According to an embodiment, the speaker module 420 may be disposed underthe diaphragm 410. The speaker module 420 may convert an electricalsignal received, for example, from a printed circuit board (e.g., thePCB 340 in FIG. 3 ) of the electronic device 400 into a sound signalthrough the vibration of the diaphragm 410. According to variousembodiments, the speaker module 420 may include various speakercomponents such as, for example, and without limitation, a yoke, amagnet, a plate, a voice coil, or the like.

According to an embodiment, the housing 450 may accommodate the speakermodule 420. The housing 450 may include a first housing 430 (e.g., anupper housing) and a second housing 440 (e.g., a lower housing). Thehousing 450 may include the first housing 430 and the second housing 440combined with each other. The first housing 430 and the second housing440 may be disposed above and under the speaker module 420,respectively. The first housing 430 may, for example, be formed of asingle material (e.g., metal) and extend above the speaker module 420.The first housing 430 may be combined with a first plate 432 formed, forexample, of another material (e.g., plastic). The second housing 440may, for example, be formed of a single material (e.g., metal) andextend under the speaker module 420. The second housing 440 may becombined with a second plate 442 formed, for example, of anothermaterial (e.g., plastic).

According to various embodiments, a support member (e.g., a support) 425may be disposed between the second housing 440 and the speaker module420. The support member 425 may absorb a shock transmitted to the secondhousing 440 through the speaker module 420 when the diaphragm 410disposed above the speaker module 420 vibrates. The support member 425may include, for example, and without limitation, a sponge, a nonwovenfabric, or the like, or any equivalent thereof. According to anembodiment, the support member 425 may be omitted. In this case, thespeaker module 420 and the second housing 440 may be integrally formed.The left side of the speaker module 420 may include, at least in part, astepped portion. The speaker module 420 may be spatially connected tothe first space 460 through a ventilation hole (not shown) formed on atleast a portion of the left side thereof.

According to an embodiment, the housing 450 may define the first space460 and the second space 470. The first space 460 may be provided in afirst direction (e.g., leftward) from the diaphragm 410 and the speakermodule 420. The second space 470 may be provided in a second direction(e.g., rightward) from the diaphragm 410 and the speaker module 420.

According to various embodiments, the first space 460 may be spatiallyconnected to the ventilation hole (not shown) provided on at least aportion of the left side of the speaker module 420 to allow air to passthrough. Other than this, the first space 460 may be sealed. The secondspace 470 may be provided to connect the diaphragm 410 and the soundoutput port 402. The second space 470 may be open without being sealed.The speaker module 420 may have a ventilation structure in which thediaphragm 410 and the second space 470 are spatially connected to allowair to pass through.

According to an embodiment, the air adsorption member 500 may beprovided at least in part in the first space 460. The air adsorptionmember 500 may, for example, include a solidified mixture having amolecular structure of particles and binders, or any other suitable airadsorption material, and may facilitate the adsorption and relaxation ofthe air 501 contained in the first space 460. The air adsorption member500 may, for example, have a volume ratio in a range of about 70% toabout 90% of the first space 460. In the first space 460, a space otherthan the air adsorption member 500 may, for example, be filled with theair 501.

The aforementioned volume ratio of about 70% to about 90% is an exampleonly and it will be understood that the disclosure is not limited tothis ratio. For example, according to various embodiments, the firstspace 160 may contain the air adsorption member 500 ranging from about10% to about 99% in volume ratio and also contain the air 501 in theremaining space.

FIG. 5 is a diagram illustrating an example air adsorption memberincluded in an electronic device according to an embodiment of thedisclosure. FIG. 6 is a diagram illustrating an air adsorption memberincluded in an electronic device according to an embodiment of thedisclosure.

Referring to FIG. 5 , the air adsorption member 500 may be formed byapplying an air adsorption material 520 to a sheet 510. The sheet 510may be formed of a porous material. Absorbing the air adsorptionmaterial 520, the sheet 510 may be solidified. The sheet 510 may have asolid material including lumps connected by a binder.

Referring to FIG. 6 , the air adsorption member 500 may be formed byembedding nanofibers 620 including an air adsorption material in thesheet 510.

According to an embodiment, when the air 501 in the first space 460 iscompressed by the vibration of the diaphragm 410 disposed above thespeaker module 420 shown in FIG. 4 , the air adsorption material 520 ofthe air adsorption member 500 may positively adsorb air and therebyminimize and/or reduce air resistance to the diaphragm 410.

According to an embodiment, when the air 501 in the first space 460 isrelaxed or expanded by the vibration of the diaphragm 410 disposed abovethe speaker module 420, the air adsorption material 520 of the airadsorption member 500 may negatively adsorb air and thereby minimizeand/or reduce air resistance to the diaphragm 410.

FIG. 7 is a diagram illustrating a molecular structure of an example airadsorption material included in an electronic device according tovarious embodiments of the disclosure.

Referring to FIG. 7 , the air adsorption material 520 according tovarious embodiments may include a mixture having a molecular structureof particles 702 and binders 704 to perform positive and negativeadsorptions of air.

According to an embodiment, the air adsorption material 520 may beformed, for example, by mixing binders with at least one of granularactivated carbon, powdered activated carbon, or acid red 27-crosslinkedpolyaniline (ARCP).

According to an embodiment, the air adsorption material 520 may beformed, for example, by mixing binders with Cu, Po1, Zr1, Zr2, or Alparticles having a metal organic frameworks structure.

According to an embodiment, the air adsorption material 520 may beformed, for example, by mixing binders with at least one of adiatomaceous earth element, a pearlite or silicon dioxide element, or azeolite element.

According to an embodiment, the air adsorption material 520 may beformed, for example, to have a specific surface area greater than thesurface area of a single solid matter. The air adsorption material 520may be formed, for example, to have a structure capable of increasingthe adsorption efficiency of specific element(s) such as, for example,and without limitation, nitrogen (N₂) and/or oxygen (O₂) contained inthe air.

FIG. 8 is a diagram illustrating an example air adsorption member fixedto a housing of an electronic device according to an embodiment of thedisclosure.

In describing the embodiment illustrated in FIG. 8 , the description ofthe same configuration and functions as those of the above-describedembodiments shown in FIGS. 4, 5, 6 and 7 may be omitted.

Referring to FIG. 8 , the air adsorption member 500 may be fixed to thesecond housing 440 (e.g., the lower housing) through a fixing member 441formed on the second housing 440 and thereby disposed in the first space460.

According to an embodiment, the fixing member 441 may be formed at acertain position of the second housing 440. The fixing member 441 may beor include, for example, a convex or protruding portion. The fixingmember 441 may, for example, be integrally formed with the secondhousing 440.

FIG. 9 is a diagram illustrating an example air adsorption member fixedto a housing of an electronic device according to an embodiment of thedisclosure.

In describing the embodiment illustrated in FIG. 9 , the description ofthe same configuration and functions as those of the above-describedembodiments shown in FIGS. 4, 5, 6 and 7 may be omitted.

Referring to FIG. 9 , the air adsorption member 500 may be interposedbetween shock absorbing members 445 formed on an inner side of the firsthousing 430 (e.g., the upper housing) and an inner side of the secondhousing 440 (e.g., the lower housing), respectively, and therebydisposed in the first space 460.

According to an embodiment, the shock absorbing member 445 may be orinclude, for example, and without limitation, a sponge. The shockabsorbing member 445 may prevent and/or reduce the solidified airadsorption member 500 from being impacted inside the first space 460.The shock absorbing member 445 may be provided to only one of the innerside of the first housing 430 and the inner side of the second housing440.

FIG. 10 is a diagram illustrating an example air adsorption member fixedto a housing of an electronic device according to an embodiment of thedisclosure.

In describing the embodiment illustrated in FIG. 10 , the description ofthe same configuration and functions as those of the above-describedembodiments shown in FIGS. 4, 5, 6 and 7 may be omitted.

Referring to FIG. 10 , the air adsorption member 500 may be adhered, forexample, to an adhesive tape 447 provided on an inner side of the secondhousing 440 (e.g., the lower housing) and thereby disposed in the firstspace 460.

The air adsorption member 500 may be adhered, for example, to theadhesive tape 447 formed on an inner side of the first housing 430(e.g., the upper housing) (not shown) and thereby disposed in the firstspace 460.

FIG. 11 is a diagram illustrating an example air adsorption member fixedby a rib formed in a housing of an electronic device according to anembodiment of the disclosure.

In describing the embodiment illustrated in FIG. 11 , the description ofthe same configuration and functions as those of the above-describedembodiments shown in FIGS. 4, 5, 6 and 7 may be omitted.

Referring to FIG. 11 , the air adsorption member 500 may be fixed, forexample, to a pair of ribs 449 formed on the second housing 440 (e.g.,the lower housing) of the electronic device 400 and thereby disposed inthe first space 460.

According to an embodiment, the second housing 440 may include the pairof ribs 449 formed on an inner side of the second housing 440 and spacedapart from each other. The ribs 449 may be integrally formed with thesecond housing 440. The air adsorption member 500 may be fixed by, forexample, being inserted between the pair of ribs 449.

FIG. 12 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure.

In describing the embodiment illustrated in FIG. 12 , the description ofthe same configuration and functions as those of the above-describedembodiments shown in FIGS. 4, 5, 6 and 7 may be omitted.

Referring to FIG. 12 , the air adsorption member 500 may be disposed atleast in part in the first space 460. The first space 460 may containthe air 501.

According to an embodiment, the air adsorption member 500 may be in asolidified state. An outer side of the air adsorption member 500 may becombined, at least in part, with the housing 450 forming the first space460, and an inner side of the air adsorption member 500 may be filledwith a homogeneous or heterogeneous powder and granulated mixture 530.

FIG. 13 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure.

In describing the embodiment illustrated in FIG. 13 , the description ofthe same configuration and functions as those of the above-describedembodiments shown in FIGS. 4, 5, 6 and 7 may be omitted.

Referring to FIG. 13 , at least a portion of the solidified airadsorption member 500 may be combined with the housing 450 at a positionadjacent to the speaker module 420, thereby forming a partition wall.

According to an embodiment, a ventilation mesh 435 may be provided to anupper portion of the first housing 430. The first space 460 may befilled with the homogeneous or heterogeneous powder and granulatedmixture 530. The powder and granulated mixture 530 may not invade thespeaker module 420 due to the partition wall. The powder and granulatedmixture 530 may be injected into at least a portion of the first space460, which may be then sealed by the ventilation mesh 435. Theventilation mesh 435 may be replaced with the air adsorption member 500.

FIG. 14 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure.

In describing the embodiment illustrated in FIG. 14 , the description ofthe same configuration and functions as those of the above-describedembodiments shown in FIGS. 4, 5, 6 and 7 may be omitted.

Referring to FIG. 14 , the electronic device 400 may include a passiveradiator 451. A portion of the housing 450, e.g., a portion of the firsthousing 430 adjacent to the second housing 440, may be removed andreplaced with the passive radiator 451 adjacent the first space 460.

According to an embodiment, the first space 460 may be filled at leastin part with the air adsorption member 500. The air adsorption member500 may have a volume ratio of less than about 100% of the first space460. In the first space 460, a space other than the air adsorptionmember 500 may be filled with the air 501.

FIG. 15 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure.

In describing the embodiment illustrated in FIG. 15 , the description ofthe same configuration and functions as those of the above-describedembodiments shown in FIGS. 4, 5, 6 and 7 may be omitted.

Referring to FIG. 15 , the electronic device 400 may include a duct 453.A portion of the housing 450, e.g., a portion of the first housing 430adjacent to the second housing 440, may be removed and replaced with theduct 453 adjacent the first space 460. The duct 453 may increase a soundpressure of a specific frequency band through phase inversion. The duct453 may, for example, contain holes with curved paths to realize phaseinversion and compensate for a specific frequency.

According to an embodiment, the first space 460 may be filled at leastin part with the air adsorption member 500. For example, when theventilation mesh 435 shown in FIG. 13 is formed at the upper portion ofthe first housing 430, the air adsorption member 500 may be providedaround the ventilation mesh 435.

FIG. 16 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure.

In describing the embodiment illustrated in FIG. 16 , the description ofthe same configuration and functions as those of the above-describedembodiments shown in FIGS. 4, 5, 6 and 7 may be omitted.

Referring to FIG. 16 , the electronic device 400 may include the airadsorption member 500 that replaces a part or all of the first housing430 and the second housing 440.

According to an embodiment, outer surfaces of the first and secondhousings 430 and 440 replaced by the air adsorption member 500 may becoated with a coating member 540. The coating member 540 may preventand/or reduce the sound from leaking to the outside of the first space460.

According to various embodiments, only a part of the first and secondhousings 430 and 440 may be replaced by the air adsorption member 500.In this case, the outer surface of the air adsorption member 500 may betreated by heat, pressure, or ultraviolet (UV) light. This is toeliminate and/or reduce a function of compressing and relaxing the airsuch that the sound does not leak to the outside through the first space460.

According to various embodiments, when only a part of the first andsecond housings 430 and 440 is replaced by the air adsorption member500, the outer surface of the air adsorption member 500 may be coveredwith a tape or any equivalent such that the sound does not leak (orleakage is reduced) to the outside through the first space 460.

FIG. 17 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure.

In describing the embodiment illustrated in FIG. 17 , the description ofthe same configuration and functions as those of the above-describedembodiments shown in FIGS. 4, 5, 6, 7 and 16 may be omitted.

Referring to FIG. 17 , the electronic device 400 may include the airadsorption member 500 disposed at least in part in the second space 470between the diaphragm 410 and the sound output port 402. In this case,the air adsorption member 500 may improve noise for the sound output tothe sound output port 402 through the diaphragm 410.

FIG. 18 is a cross-sectional view illustrating an example configurationof an electronic device including an air adsorption member and a speakermodule according to an embodiment of the disclosure.

In describing the embodiment illustrated in FIG. 18 , the description ofthe same configuration and functions as those of the above-describedembodiments shown in FIGS. 4, 5, 6, 7, 16 and 17 may be omitted.

Referring to FIG. 18 , the electronic device 400 may include the airadsorption member 500 provided in at least a part of the first housing430 (or the first plate 432) disposed over the diaphragm 410.

According to an embodiment, the air adsorption member 500 provided in atleast a part of the first housing 430 (or the first plate 432) may bepositioned to be biased toward one side of the diaphragm 410. Forexample, the air adsorption member 500 may be disposed at a position tominimize and/or reduce eccentric vibration of the diaphragm 410. The airadsorption member 500 may be disposed at a position where the upperresistance of the diaphragm 410 is relatively large.

According to various example embodiments of the disclosure, anelectronic device may include: a diaphragm; a speaker module comprisinga speaker configured to output a sound through a vibration of thediaphragm; a housing accommodating the diaphragm and the speaker moduletherein and including a first space provided in a first direction fromthe speaker module and a second space provided in a second directionopposite the first direction; and an air adsorption member comprising anair adsorption material disposed in the first space and having a volumeratio in a range of 90% or less of the first space.

According to various example embodiments, the air adsorption member maybe solidified at least in part.

According to various example embodiments, the first space may be sealedand may contain air at least in part.

According to various example embodiments, the housing may include afirst housing disposed above the diaphragm; and a second housing 440disposed under the speaker module.

According to various example embodiments, the air adsorption member maybe fixed to a fixing member formed on the second housing.

According to various example embodiments, the air adsorption member maybe combined with a shock absorbing member provided on at least one of aninner side of the first housing or an inner side of the second housing.

According to various example embodiments, the air adsorption member maybe adhered to an adhesive tape provided on at least one of an inner sideof the first housing or an inner side of the second housing.

According to various example embodiments, the air adsorption member maybe fixed between a pair of ribs provided on the second housing.

According to various example embodiments, the air adsorption member maycomprise an air adsorption material applied to a sheet, and the airadsorption material may have a molecular structure of particles andbinders configured to perform positive and negative adsorptions of air.

According to various example embodiments, the air adsorption member maybe solidified at least in part, an outer side of the air adsorptionmember may be combined with the housing forming the first space, and aninner side of the air adsorption member may be filled with a homogeneousor heterogeneous powder and granulated mixture.

According to various example embodiments, the air adsorption member maybe solidified at least in part and combined with the housing at aposition adjacent to the speaker module, thereby forming a partitionwall in the first space 460.

According to various example embodiments, the first space separated bythe partition wall may be filled at least in part with a homogeneous orheterogeneous powder and granulated mixture.

According to various example embodiments, the housing may have aventilation mesh provided to an upper portion thereof, and theventilation mesh may be formed of the air adsorption member.

According to various example embodiments, the electronic device mayfurther include a passive radiator or a duct provided at a predeterminedposition with respect to the first space.

According to various example embodiments of the disclosure, anelectronic device may include: a diaphragm; a speaker module comprisinga speaker configured to output a sound through a vibration of thediaphragm; a housing accommodating the diaphragm and the speaker moduletherein, of the housing including a first housing disposed at an upperposition and a second housing disposed at a lower position, andincluding a first space formed in a first direction from the speakermodule and a second space formed in a second direction opposite thefirst direction; and an air adsorption member provided in at least apart of the first and/or second housing and/or disposed between thefirst and second housings, the air adsorption member configured toadsorb air in the first space and/or the second space.

According to various example embodiments, an outer surface of the airadsorption member may be coated with a coating member.

According to various example embodiments, an outer surface of the airadsorption member may be treated at least in part to eliminate and/orreduce a function of compressing and relaxing the air and therebyprevent and/or reduce the sound from leaking to an outside of the firstspace.

According to various example embodiments, the first space may be sealedand may contain air at least in part.

According to various embodiments, the second space may be providedbetween the diaphragm and a sound output port, and the air adsorptionmember may be disposed at a predetermined position of the second space.

According to various example embodiments, at least a part of the firsthousing disposed over the diaphragm may contain the air adsorptionmember to minimize and/or reduce eccentric vibration of the diaphragm.

While the disclosure has been illustrated and described with referenceto various example embodiments thereof, it will be understood that thevarious example embodiments are intended to be illustrative, notlimiting. One of ordinary skill in the art will understand that variouschanges in form and details may be made therein without departing fromthe true spirit and full scope of the disclosure, including the appendedclaims and their equivalents.

What is claimed is:
 1. An electronic device comprising: a diaphragm; aspeaker module comprising a speaker configured to output a sound througha vibration of the diaphragm; a housing accommodating the diaphragm andthe speaker module therein, the housing including: a first spaceprovided in a first direction from the speaker module, and a secondspace provided in a second direction opposite the first direction; andan air adsorption member comprising an air adsorption material disposedin the first space and having a volume ratio of 90% or less of the firstspace.
 2. The electronic device of claim 1, wherein the air adsorptionmember is at least partially solidified.
 3. The electronic device ofclaim 1, wherein the first space is sealed and at least partiallyincludes air.
 4. The electronic device of claim 1, wherein the housingincludes: a first housing disposed above the diaphragm; and a secondhousing disposed under the speaker module.
 5. The electronic device ofclaim 4, wherein the air adsorption member is fixed to a protrusionprotruding from the second housing.
 6. The electronic device of claim 4,wherein the air adsorption member is combined with a shock absorbingmember comprising a shock absorbing material disposed on at least one ofan inner side of the first housing or an inner side of the secondhousing.
 7. The electronic device of claim 4, wherein the air adsorptionmember is adhered to an adhesive tape disposed on at least one of aninner side of the first housing or an inner side of the second housing.8. The electronic device of claim 4, wherein the air adsorption memberis fixed between a pair of ribs provided on the second housing.
 9. Theelectronic device of claim 1, wherein the air adsorption membercomprises an air adsorption material applied to a sheet, and wherein theair adsorption material has a molecular structure including particlesand binders configured to perform positive and negative adsorptions ofair.
 10. The electronic device of claim 1, wherein the air adsorptionmember is at least partially solidified, an outer side of the airadsorption member is combined with the housing forming the first space,and an inner side of the air adsorption member is filled with a powderand granulated mixture.
 11. The electronic device of claim 1, whereinthe air adsorption member is at least partially solidified and providedat a position of the housing adjacent to the speaker module, anddefining a partition wall in the first space.
 12. The electronic deviceof claim 11, wherein the first space separated by the partition wall isfilled at least in part with a powder and granulated mixture.
 13. Theelectronic device of claim 11, wherein the housing includes aventilation mesh provided to an upper portion thereof, and wherein theventilation mesh comprises at least a portion of the air adsorptionmember.
 14. The electronic device of claim 1, wherein the electronicdevice further comprises a passive radiator or a duct provided at apredetermined position of the first space.
 15. An electronic devicecomprising: a diaphragm; a speaker module comprising a speakerconfigured to output a sound through a vibration of the diaphragm; ahousing accommodating the diaphragm and the speaker module therein, thehousing including a first housing disposed at an upper position of thehousing and a second housing disposed at a lower position of thehousing, the housing further including: a first space provided in afirst direction from the speaker module, and a second space provided ina second direction opposite the first direction; and an air adsorptionmember comprising an air adsorbing material disposed in at least a partof the first and/or second housing or disposed between the first and thesecond housing, the air adsorption member configured to adsorb air inthe first space and/or the second space.
 16. The electronic device ofclaim 15, wherein an outer surface of the air adsorption member includesa coating.
 17. The electronic device of claim 15, wherein an outersurface of the air adsorption member is configured to reduce compressingand relaxing the air and to reduce leakage of the sound to an outside ofthe first space.
 18. The electronic device of claim 15, wherein thefirst space is sealed and at least partially contains air.
 19. Theelectronic device of claim 15, wherein the second space is providedbetween the diaphragm and a sound output port, and wherein the airadsorption member is disposed at a predetermined position of the secondspace.
 20. The electronic device of claim 15, wherein at least a part ofthe first housing disposed over the diaphragm includes the airadsorption member and is configured to reduce eccentric vibration of thediaphragm.